Electronic circuit boards’ heat dissipation capability directly impacts their service life since the heat dissipation efficiency of components directly impacts the board’s life. This work focused on the problem of the high surface temperature of the electronic components at the control unit stage of a cement production line. Three dimensional CFD model has been developed to simulate all components in this circuit board. A thermographic camera has been used to measure the surface temperatures of the components on the circuit board. Consistency was very good in the results. Two cooling mechanisms were examined, one of which is a traditional technique by forced air cooling technology. The other is using graphene nanosheets coating technology to increase the dissipation of the generated heat to the surrounding atmosphere. Although an electronic fan was very effective in cooling the electronic circuit components, which reduced the temperature by 22.6%, it has two undesirable features: the need to install it in a safe place and the need for power to run it. Graphene nanosheets coatings provide efficient and economical heat dissipation. The thin graphene layer enhances the radiation effect for the heat significantly. The results showed that the smooth aluminium plate coated with graphene and mounted directly to the back part of the transistor behind the plastic chip carrier piece for heat dissipation provided an efficient, sustainable and economical solution in thermal management. In comparison with the fan, the graphene nanosheets coating technology reduces the temperature by an average of 16.4% without consuming any energy.

• Al-Baghdadi, M. (2009). A CFD study of hygro–thermal stresses distribution in PEM fuel cell during regular cell operation. Renewable Energy, 34(3), 674-682. https://doi.org/10.1016/j.renene.2008.05.023

• Al-Baghdadi, M. (2010). A CFD analysis of transport phenomena and electrochemical reactions in a tubular-shaped ambient air-breathing PEM micro fuel cell. HKIE Transactions, 17(2), 1-8. https://doi.org/10.1080/1023697X.2010.10668189

• Al-Baghdadi, M., Noor, Z., Zeiny, A., Burns, A., & Wen, D. (2020). CFD analysis of a nanofluid-based microchannel heat sink. Thermal Science and Engineering Progress, 20, Article 100685. https://doi.org/10.1016/j.tsep.2020.100685

• Alhattab, H. A., Al-Baghdadi, M., Hashim, R., & Ali, A. (2016). Design of micro heat sink for power transistor by using CFD. In Al-Sadiq International Conference on Multidisciplinary in IT and Communication Science and Applications (AIC-MITCSA) (pp. 268-272). IEEE Publishing. https://doi.org/10.1109/AIC-MITCSA.2016.7759948

• Ali, S., Ahmad, F., Yusoff, P., Muhamad, N., Oñate, E., Raza, M., & Malik, K. (2021). A review of graphene reinforced Cu matrix composites for thermal management of smart electronics. Composites Part A: Applied Science and Manufacturing, 144, Article 106357. https://doi.org/10.1016/j.compositesa.2021.106357

• Brahim, T., & Jemni, A. (2021). CFD analysis of hotspots copper metal foam flat heat pipe for electronic cooling applications. International Journal of Thermal Sciences, 159, Article 106583. https://doi.org/10.1016/j.ijthermalsci.2020.106583

• Çengel, Y. A. (2007). Heat and mass transfer: A practical approach. McGraw-Hill Higher Education.

• Cheng, C., Chang, P., Li, H., & Hsu, F. (2020). Design of a single-phase immersion cooling system through experimental and numerical analysis. International Journal of Heat and Mass Transfer, 160, Article 120203. https://doi.org/10.1016/j.ijheatmasstransfer.2020.120203

• Chu, W., Tsai, M., Jan, S., Huang, H., & Wang, C. (2020). CFD analysis and experimental verification on a new type of air-cooled heat sink for reducing maximum junction temperature. International Journal of Heat and Mass Transfer, 148, Article 119094. https://doi.org/10.1016/j.ijheatmasstransfer.2019.119094

• Fan, D., Jin, M., Wang, J., Liu, J., & Li, Q. (2020). Enhanced heat dissipation in graphite-silver-polyimide structure for electronic cooling. Applied Thermal Engineering, 168, Article 114676. https://doi.org/10.1016/j.applthermaleng.2019.114676

• Galins, J., Laizans, A., & Galins, A. (2019). Review of cooling solutions for compact electronic devices. Research for Rural Development, 1, 201-208. https://doi.org/10.22616/rrd.25.2019.030

• Gan, J., Yu, H., Tan, M., Soh, A., Wu, H., & Hung, Y. (2020). Performance enhancement of graphene-coated micro heat pipes for light-emitting diode cooling. International Journal of Heat and Mass Transfer, 154, Article 119687. https://doi.org/10.1016/j.ijheatmasstransfer.2020.119687

• Ghyadh, N., Ahmed, S., & Al-Baghdadi, M. (2021). Enhancement of forced convection heat transfer from cylindrical perforated fins heat sink - CFD Study. Journal of Mechanical Engineering Research and Developments, 44(3), 407-419.

• He, Z., Yan, Y., & Zhang, Z. (2021). Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review. Energy, 216, Article 119223. https://doi.org/10.1016/j.energy.2020.119223

• Hsieh, C., Chen, Y., Lee, C., Chiang, Y., Hsieh, K., & Wu, H. (2017). Heat transport enhancement of heat sinks using Cu-coated graphene composites. Materials Chemistry and Physics, 197, 105-112. https://doi.org/10.1016/j.matchemphys.2017.05.012

• Jaafar, A. A., Al-Abassi, S. A. W., Alhattab, H. A., Albaghdad, M. A., Mosa, A. A., Al-Musawi, H. K., & Gneem, L. M. (2020). Improvement of heat sink performance by using graphene nanosheets coated by chemical spray method. In IOP Conference Series: Materials Science and Engineering (Vol. 811, No. 1, p. 012027). IOP Publishing. https://doi.org/10.1088/1757-899X/811/1/012027

• Moffat, R. J. (1985). Using uncertainty analysis in the planning of an experiment. Journal of Fluids Engineering, 107, 173-178. https://doi.org/10.1115/1.3242452

• Rohachev, V. A., Terekh, O. M., Baranyuk, A. V., Nikolaenko, Y. E., Zhukova, Y. V., & Rudenko, A. I. (2020). Heataerodynamic efficiency of small size heat transfer surfaces for cooling thermally loaded electronic components. Thermal Science and Engineering Progress, 20, Article 100726, https://doi.org/10.1016/j.tsep.2020.100726.

• Wong, R., Antoniou, A., & Smet, V. (2021). Copper-graphene foams: A new high-performance material system for advanced package-integrated cooling technologies. In 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (pp. 1945-1951). IEEE Publishing. https://doi.org/10.1109/ectc32696.2021.00307

• Xie, L., Yuan, X., & Wang, W. (2021). Thermal-flow network modeling for virtual prototyping of power electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11(8), 1282-1291. https://doi.org/10.1109/TCPMT.2020.3009156

• Yang, D., Yao, Q., Jia, M., Wang, J., Zhang, L., Xu, Y., & Qu, X. (2021). Application analysis of efficient heat dissipation of electronic equipment based on flexible nanocomposites. Energy and Built Environment, 2(2), 157-166. https://doi.org/10.1016/j.enbenv.2020.07.008

• Zhuang, D., Yang, Y., Ding, G., Du, X., & Hu, Z. (2020). Optimization of microchannel heat sink with rhombus fractal-like units for electronic chip cooling. International Journal of Refrigeration, 116, 108-118. https://doi.org/10.1016/j.ijrefrig.2020.03.026

• Zu, H., Dai, W., Li, Y., Li, K., & Li, J. (2021). Analysis of enhanced heat transfer on a passive heat sink with high-emissivity coating. International Journal of Thermal Sciences, 166, Article 106971. https://doi.org/10.1016/j.ijthermalsci.2021.106971